Features: • Low Cost• Thick Film Technology• High Density Packaging• Leadless Surface Mount Construction• Tape and Reel Packaging• Solder Coated Nickel Barrier Pads• Isolated and Bussed Circuits• Concave and Convex Terminations• RoHS Compliant ...
741X043: Features: • Low Cost• Thick Film Technology• High Density Packaging• Leadless Surface Mount Construction• Tape and Reel Packaging• Solder Coated Nickel Barrier Pa...
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