Features: `Low overall system chip count. True one chip solution for embedded systems`Low operating power (~120mW @3.3V, `automatic low power standby and power down options available) `Internal ROM and RAM for normal operation `On chip optional hybrid driver `Designed for +3.15 through +3.6 volt...
73M2901/3.3V: Features: `Low overall system chip count. True one chip solution for embedded systems`Low operating power (~120mW @3.3V, `automatic low power standby and power down options available) `Internal RO...
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Networking Development Tools 73M2901CE Demo Brd Us
Vref =1.25V; VPA = 3.3V | |
QAM | -9.6 |
DPSK | -7.4 |
FSK | -5.3 |
DTMF (high tone) | -7.9 |
DTMF (low tone) | -9.8 |
DTMF (total) | -5.7 |
The 73M2901/3.3V is a single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. This device is based on TDK Semiconductor' s implementation of the ustrstandard 8032 microcontroller core with a proprietary multiply and accumulate (MAC) coprocessor; Sigma-Delta A/D and D/A converters; and an analog front end. The ROM and RAM necessary to operate the modem are contained on the ice. Additionally, the 73M2901/3.3V provides an on-chip oscillator and Hybrid driver.
The 73M2901/3.3V is a high performance, low voltage, low power, single chip modem capable of data transmission and reception through 2400bps.The 73M2901/3.3V is intended for embedded applications and battery operation. This evice
offers low power 3.3 volt design with optional internal hybrid and country specific call progress support.