Board to Board / Mezzanine Connectors DX HCC DR.100 DP SMT
71609-314: Board to Board / Mezzanine Connectors DX HCC DR.100 DP SMT
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US $.34 - .52 / Piece
Headers & Wire Housings 2X2P SNGL BEAM RCPL 30 microinch gold
US $.25 - .34 / Piece
Headers & Wire Housings 2X3P SNGL BEAM RCPL 30 microinch gold
Series : | 71609 | Pitch : | 2.54 mm | ||
Mounting Style : | SMD/SMT | Mounting Angle : | Horizontal | ||
Number of Positions / Contacts : | 28 | Housing Material : | Glass Filled Polyamide (PA) | ||
Contact Material : | Copper Alloy | Contact Plating : | Gold (30) |
Technical/Catalog Information | 71609-314 |
Vendor | FCI |
Category | Connectors |
Color | Gray |
Connector Type | Receptacle, Socket |
Contact Finish | Gold |
Contact Finish Thickness | 30in (0.76m) |
Features | - |
Height Above Board | 0.230" (5.85mm) |
Height Stacking (Mating) | - |
Mounting Type | Surface Mount, Right Angle |
Number of Contacts Loaded | All |
Number of Positions | 28 |
Number of Rows | 2 |
Packaging | Tube |
Pitch | 0.100" (2.54mm) |
Row Spacing | 0.100" (2.54mm) |
Termination | Solder |
Lead Free Status | Contains Lead |
RoHS Status | RoHS Non-Compliant |
Other Names | 71609 314 71609314 |