6417

Input Supply Voltage
                                                                                  7.5V
Internal Power Dissipation
(Note 2, 3)
                                                                                  Internally Limited
Operating Ambient Temperature
                                                                                  -55 C to +125 C
Storage Temperature Range
                                                                                  -65 C to +150 C
Maximum Junction Temperature
                                                                                  150 C
Thermal Resistance
(Note 3)
ThetaJA
   CERDIP        (Still Air)                                              74 C/W
                  (500LF/Min Air flow)                                 37 C/W
   CERAMIC SOIC  (Still Air)                                         122 C/W
                  (500LF/Min Air flow)                                  77 C/W
ThetaJC
     CERDIP                                                                  4 C/W
     CERAMIC SOIC                                                       5 C/W
Package Weight
  CEDIP                                                                        1970mg
  CERAMIC SOIC                                                           360mg
Lead Temperature
 (Soldering, 5 seconds)                                                260 C
ESD Susceptibility
(Note 4)
                                                                                    4kV
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur.Operating Ratings are conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions see the Electrical Characteristics. The guaranteed specification apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. 

Note 2: The maximum power dissipation must be derated at elevated temperatures and is dictated by Tjmax (maximum junction temperature), ThetaJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is Pdmax = (Tjmax - TA)/ThetaJA or the number given in the Absolute Maximum Ratings, whichever is lower. 

Note 3: The package material for these devices allows much improved heat transfer over our standard ceramic packages. In order to take full advantage of this improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either metal traces on, or thermal vias through, the printed circuit board. Without this additional heat sinking, device power dissipation must be calculated using junction-to-ambient, rather than junction-to-case, thermal resistance. It must not be assumed that the device leads will provide substantial heat transfer out of the package, since the thermal resistance of the leadframe material is very poor, relative to the material of the package base. The stated junction-to-case thermal resistance is for the package material only, and does not account for the additional thermal resistance between the package base and the printed circuit board. The user must determine the value of the additional thermal resistance and must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device. 

Note 4: Human body model, 100pF discharged through 1.5K Ohms

The 6417 is a 1A low dropout regulator designed to provide 3.3V from a 5V supply. The 6417 is ideally suited for systems which contain both 5V and 3.3V logic, with prime power provided from a 5V bus.

Because the 6417 is a true low dropout regulator, it can hold its 3.3V output in regulation with input voltages as low as 4.5V.