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630-60AB

HEATSINK FOR BGA 35MM

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SeekIC No. : 003444833 Detail

630-60AB: HEATSINK FOR BGA 35MM

630-60AB Data Sheet

floor Price/Ceiling Price

US $ .71~.71 / Piece | Get Latest Price
Part Number:
630-60AB
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 0~1200
  • Unit Price
  • $.71
  • Processing time
  • 15 Days
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Total Cost: $ 0.00

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Upload time: 2025/1/14

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Product Details

Quick Details

Capacitance : 16.5 pF Series: 630
Manufacturer: Wakefield Thermal Solutions Type: Top Mount
Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Not Included)
Shape: Square, Pin Fins Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm) Diameter: -
Height Off Base (Height of Fin): 0.598" (15.20mm) Power Dissipation @ Temperature Rise: -
Thermal Resistance @ Forced Air Flow: 3.0°C/W @ 350 LFM Thermal Resistance @ Natural: -
Material: Aluminum    

Description

Diameter: -
Power Dissipation @ Temperature Rise: -
Material: Aluminum
Material Finish: Black Anodized
Package Cooled: BGA
Thermal Resistance @ Natural: -
Type: Top Mount
Width: 1.378" (35.00mm)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Shape: Square, Pin Fins
Manufacturer: Wakefield Thermal Solutions
Height Off Base (Height of Fin): 0.598" (15.20mm)
Length: 1.378" (35.00mm)
Series: 630
Thermal Resistance @ Forced Air Flow: 3.0°C/W @ 350 LFM


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