Features: • Wire bondable• Only one wire bond required• Small size: 0.020 inches square.• Resistance range: 10 to 1 M• Oxidized silicon substrate for good power dissipation• Resistor material: Tantalum nitride, self-passivating• Moisture resistantApplicat...
61023: Features: • Wire bondable• Only one wire bond required• Small size: 0.020 inches square.• Resistance range: 10 to 1 M• Oxidized silicon substrate for good power dissip...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
Vishay EFI BCR resistor chips are widely used in hybrid packages where space is limited. The bottom connection is made by attaching the back of the chip to the substrate either eutectically or with conductive epoxy. The single wire bond is made to the notched pad on the top of the chip. (The other rectangular pad on the top of the chip is a via hole, a low-ohmic contact connecting the resistor to the bottom of the chip.)
The Back Contact Resistor (BCR) 61023 series single-value back-contact resistor chip is one of the smallest chips available. The BCR requires only one wire bond thus saving hybrid space. The BCRs 61023 are manufactured using Vishay Electro-Films (EFI) sophisticated thin film equipment and manufacturing technology. The BCRs 61023 are 100 % electrically tested and visually inspected to MIL-STD-883.