5962-89570

These 5962-89570 are single and dual channel, hermetically sealed optocouplers. The 5962-89570 are capable of operation and storage over the full military temperature range and can be purchased as either standard product or with full MIL-PRF-38534 Class Level H or K testing or from the appropriate DESC Drawing. 5962-89570are manufactured and tested on a MIL-PRF-38534 certified line and are included in the DESC Qualified Manufacturers List QML-38534 for Hybrid Microcircuits.data rate capability. The detector has a threshold with hysteresis,which typically provides 0.25 mA of differential mode noise immunity and minimizes the potential for output signal chatter. The detector 5962-89570 in the single channel units has a three state output stage which eliminates the need for a pull-up resistor and allows for direct drive of a data bus.

5962-89570 are compatible with TTL,STTL, LSTTL, and HCMOS logic families. The 35 ns pulse width distortion specification guarantees a 10 MBd signaling rate at +125°C with 35% pulse width distortion. Figures 13 through 16 show recommended circuits for reducing pulse width distortion and optimizing the signal rate of the product. Package styles for 5962-89570 are 8 pin DIP through hole (case outlines P), and leadless ceramic chip carrier (case outline 2). Devices may be purchased with a variety of lead bend and plating options. See Selection Guide Table for details.

Standard Military Drawing (SMD) parts are available for each package and lead style.Because the same electrical die (emitters and detectors) are used for each channel of 5962-89570 listed in this data sheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the figures are similar for all parts.

Occasional exceptions exist due to package variations and limitations and are as noted. Additionally,the same package assembly processes and materials are used in all devices. These similarities of 5962-89570 give justification for the use of data obtained from one part to represent other part's performance for die related reliability and certain limited radiation test results.