Features: • Helps to eliminate mixed technology PC boards.• Unique patented low part count design.• Compatible with automatic placement equipment.• Compatible with infrared and vapor phase solder processes.• Packaged on 12mm tape, 7 or 13 reels per EIA- 481-1.•...
595-2x01-0xx: Features: • Helps to eliminate mixed technology PC boards.• Unique patented low part count design.• Compatible with automatic placement equipment.• Compatible with infrared a...
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Parameter | -2101 | -2201 | -2301 | -2401 | -2701 |
Color* | 21 | 22 | 23 | 24 | 27 |
Power Dissipation (derate linearly from 25°C mA/°C |
60mA .42 |
75mA .42 |
75mA .42 |
75mA .42 |
75mA .42 |
Forward DC Current | 30mA | 30mA | 30mA | 30mA | 30mA |
Peak Forward Current (10µ sec) | 70mA | 70mA | 70mA | 70mA | 70mA |
Operating Temperature | -30°C to +85°C | ||||
Storage Temperature | -30°C to +80°C | ||||
Soldering Temperatures Convection IR Vapor Phase |
260° Peak, above 120° for 2 min., 215°C for 3 Min. |