Features: • Helps to eliminate mixed technology PC board processing.• Unique patented low part count design.• Compatible with automatic placement equipment.• Compatible with infrared and vapor phase solder processes.• Packaged on 16mm tape, 7 or 13 reels per EIA-481...
591-3x0x-0xx: Features: • Helps to eliminate mixed technology PC board processing.• Unique patented low part count design.• Compatible with automatic placement equipment.• Compatible with ...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
Parameter |
-3001 |
-3101 |
-3201 |
-3503 |
Color* |
30 |
31 |
32 |
35 |
Power Dissipation |
100mW |
100mW |
100mW |
150mW Total |
Forward DC Current |
30mA |
30mA |
30mA |
20mA single chip on 30mA all chips on |
Peak Forward Current (10µsec) |
500mA |
500mA |
500mA |
|
Operating Temperature |
-55°C to +100°C | |||
Storage Temperature |
-55°C to +100°C | |||
Soldering Temperatures Convection IR Vapor Phase |
235° Peak, above 185° for 90 sec., 215°C for 3 Min. |