581001B02500

BOARD LEVEL HEAT SINK

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581001B02500 Picture
SeekIC No. : 003444145 Detail

581001B02500: BOARD LEVEL HEAT SINK

floor Price/Ceiling Price

US $ .5~.5 / Piece | Get Latest Price
Part Number:
581001B02500
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 0~5000
  • Unit Price
  • $.5
  • Processing time
  • 15 Days
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Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Quick Details

Capacitance : 16.5 pF Series: -
Manufacturer: Aavid Thermalloy Type: Board Level, Vertical
Package Cooled: TO-218 Attachment Method: Bolt On and PC Pin
Shape: Rectangular Length: 1.00" (25.40mm)
Width: 0.640" (16.26mm) Diameter: -
Height Off Base (Height of Fin): 0.640" (16.26mm) Power Dissipation @ Temperature Rise: 2.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 4°C/W @ 500 LFM Thermal Resistance @ Natural: 19.6°C/W
Material: Aluminum    

Description

Diameter: -
Material: Aluminum
Material Finish: Black Anodized
Series: -
Shape: Rectangular
Type: Board Level, Vertical
Attachment Method: Bolt On and PC Pin
Thermal Resistance @ Natural: 19.6°C/W
Manufacturer: Aavid Thermalloy
Length: 1.00" (25.40mm)
Width: 0.640" (16.26mm)
Height Off Base (Height of Fin): 0.640" (16.26mm)
Power Dissipation @ Temperature Rise: 2.5W @ 50°C
Thermal Resistance @ Forced Air Flow: 4°C/W @ 500 LFM
Package Cooled: TO-218


Pinout

  Connection Diagram


Specifications

Part # Description Finish Board Mounting
581001B02500 Flat back extruded heat sink featuring solderable pins Black Anodize View Hole Dimensions
This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component.




Description

Thermal Resistance 19.60

Thermal resistance value of 581001B02500 is based on a 75C rise in natural convection


Parameters:

Technical/Catalog Information581001B02500
VendorAavid Thermalloy
CategoryThermal Management
Attachment MethodBolt On and PC Pin
Height1" (25.4mm)
MaterialAluminum
Package CooledTO-218
Power Dissipation @ Temperature Rise2.5W @ 50°C
Thermal Resistance @ Forced Air Flow4°C/W @ 500 LFM
Outline16.25mm x 16.25mm
Thermal Resistance @ Natural19.6°C/W
Lead Free StatusContains Lead
RoHS StatusRoHS Non-Compliant
Other Names 581001B02500
581001B02500



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