BOARD LEVEL HEAT SINK
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Capacitance : | 16.5 pF | Series: | - |
Manufacturer: | Aavid Thermalloy | Type: | Board Level, Vertical |
Package Cooled: | TO-218 | Attachment Method: | Bolt On and PC Pin |
Shape: | Rectangular | Length: | 1.00" (25.40mm) |
Width: | 0.640" (16.26mm) | Diameter: | - |
Height Off Base (Height of Fin): | 0.640" (16.26mm) | Power Dissipation @ Temperature Rise: | 2.5W @ 50°C |
Thermal Resistance @ Forced Air Flow: | 4°C/W @ 500 LFM | Thermal Resistance @ Natural: | 19.6°C/W |
Material: | Aluminum |
Part # | Description | Finish | Board Mounting |
581001B02500 | Flat back extruded heat sink featuring solderable pins | Black Anodize | View Hole Dimensions |
This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component. |
Thermal Resistance | 19.60 |
Technical/Catalog Information | 581001B02500 |
Vendor | Aavid Thermalloy |
Category | Thermal Management |
Attachment Method | Bolt On and PC Pin |
Height | 1" (25.4mm) |
Material | Aluminum |
Package Cooled | TO-218 |
Power Dissipation @ Temperature Rise | 2.5W @ 50°C |
Thermal Resistance @ Forced Air Flow | 4°C/W @ 500 LFM |
Outline | 16.25mm x 16.25mm |
Thermal Resistance @ Natural | 19.6°C/W |
Lead Free Status | Contains Lead |
RoHS Status | RoHS Non-Compliant |
Other Names | 581001B02500 581001B02500 |