Heat Sinks SLV HEATSINK TO-263
573300D00010G: Heat Sinks SLV HEATSINK TO-263
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Product : | Heatsinks | Mounting Style : | SMD/SMT | ||
Heatsink Material : | Copper | Thermal Resistance : | 18 C / W | ||
Length : | 12.7 mm | Width : | 26.16 mm | ||
Height : | 10.16 mm | Designed for : | TO-263 |
Part # | Description | Finish | Board Mounting |
573300D00010G | Surface mount heat sink for D2 Pak (TO-263) package semiconductors | Matte Tin Plated | N/A |
This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component. |
Thermal Resistance | 18.00 |
Technical/Catalog Information | 573300D00010G |
Vendor | Aavid Thermalloy (VA) |
Category | Thermal Management |
Attachment Method | SMD Pad |
Height | 0.4" (10.16mm) |
Material | - |
Package Cooled | D²Pak |
Power Dissipation @ Temperature Rise | 1.25W @ 30°C |
Thermal Resistance @ Forced Air Flow | 10.0°C/W @ 200 LFM |
Outline | 26.16mm x 12.70mm |
Thermal Resistance @ Natural | 18°C/W |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | 573300D00010G 573300D00010G HS338DKR ND HS338DKRND HS338DKR |