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54AC16240

Features: Members of the Texas Instruments WidebusTM Family3-State Outputs Drive Bus Lines or Buffer Memory Address RegistersFlow-Through Architecture Optimizes PCB LayoutDistributed VCC and GND Pin Configuration Minimizes High-Speed Switching NoiseEPICTM (Enhanced-Performance Implanted CMOS) 1-mm...

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SeekIC No. : 004233074 Detail

54AC16240: Features: Members of the Texas Instruments WidebusTM Family3-State Outputs Drive Bus Lines or Buffer Memory Address RegistersFlow-Through Architecture Optimizes PCB LayoutDistributed VCC and GND Pin...

54AC16240 Data Sheet

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Part Number:
54AC16240
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

 Members of the Texas Instruments WidebusTM Family
 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
 Flow-Through Architecture Optimizes PCB Layout
 Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
 EPICTM (Enhanced-Performance Implanted CMOS) 1-mm Process
 500-A Typical Latch-Up Immunity at 125°C
 Package Options Include Plastic 300-mil Shrink Small-Outline (DL) Package Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Pin Spacings




Pinout

Connection Diagram


Specifications

Supply voltage range, VCC  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  . . . . . . . . . .  .0.5 V to 7 V
Input voltage range, VI (see Note 1)  . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . .0.5 V to VCC + 0.5 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  .0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . .±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  . . ±50 mA
Continuous output current, IO (VO = 0 to VCC)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . . .±50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .   . . . . . . .±400 mA
Maximum power dissipation at TA = 55°C (in still air)(see Note 2): DL package  . . . . . . . . . . . .1.2 W
Storage temperature range,Tstg  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. . . . . 65°C to 150°C  


Description

The 54AC16240 are 16-bit buffers and line drivers designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

54AC16240 can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide inverting outputs and symmetrical active-low output-enable (OE) inputs.

The 54AC16240 is packaged in TI's shrink small-outline package, which provides twice the I/O pin count and functionality of standard small-outline packages in the same printed circuit board area.

The 54AC16240 is characterized for operation over the full military temperature range of 55°C to 125°C.

The 74AC16240 is characterized for operation from 40°C to 85°C.




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