533001B02551G

BOARD LEVEL HEAT SINK

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SeekIC No. : 003444313 Detail

533001B02551G: BOARD LEVEL HEAT SINK

floor Price/Ceiling Price

US $ .72~.72 / Piece | Get Latest Price
Part Number:
533001B02551G
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 0~3750
  • Unit Price
  • $.72
  • Processing time
  • 15 Days
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Total Cost: $ 0.00

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Upload time: 2024/6/3

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Product Details

Quick Details

Capacitance : 16.5 pF Series: -
Manufacturer: Aavid Thermalloy Type: Board Level, Vertical
Package Cooled: TO-218, TO-247 Attachment Method: Clip and PC Pin
Shape: Rectangular Length: 1.00" (25.40mm)
Width: 1.375" (34.93mm) Diameter: -
Height Off Base (Height of Fin): 0.500" (12.70mm) Power Dissipation @ Temperature Rise: 2W @ 30°C
Thermal Resistance @ Forced Air Flow: 4°C/W @ 400 LFM Thermal Resistance @ Natural: 13°C/W
Material: Aluminum    

Description

Diameter: -
Material: Aluminum
Material Finish: Black Anodized
Series: -
Shape: Rectangular
Type: Board Level, Vertical
Height Off Base (Height of Fin): 0.500" (12.70mm)
Thermal Resistance @ Natural: 13°C/W
Attachment Method: Clip and PC Pin
Manufacturer: Aavid Thermalloy
Length: 1.00" (25.40mm)
Width: 1.375" (34.93mm)
Power Dissipation @ Temperature Rise: 2W @ 30°C
Thermal Resistance @ Forced Air Flow: 4°C/W @ 400 LFM
Package Cooled: TO-218, TO-247


Pinout

  Connection Diagram


Specifications

Part # Description Finish Board Mounting
533001B02551G Extruded heat sink with radial fins and solderable pins and device clip Black Anodize N/A
This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component.




Description

Thermal Resistance 13.00

Thermal resistance value of 533001B02551G is based on a 75C rise in natural convection


Parameters:

Technical/Catalog Information533001B02551G
VendorAavid Thermalloy
CategoryThermal Management
Attachment MethodClip and PC Pin
Height1" (25.4mm)
MaterialAluminum
Package CooledTO-218, TO-247
Power Dissipation @ Temperature Rise2W @ 30°C
Thermal Resistance @ Forced Air Flow4°C/W @ 400 LFM
Outline34.92mm x 12.70mm
Thermal Resistance @ Natural13°C/W
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names 533001B02551G
533001B02551G



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