BOARD LEVEL HEAT SINK
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Capacitance : | 16.5 pF | Series: | - |
Manufacturer: | Aavid Thermalloy | Type: | Board Level, Vertical |
Package Cooled: | TO-218, TO-247 | Attachment Method: | Clip and PC Pin |
Shape: | Rectangular | Length: | 1.00" (25.40mm) |
Width: | 1.375" (34.93mm) | Diameter: | - |
Height Off Base (Height of Fin): | 0.500" (12.70mm) | Power Dissipation @ Temperature Rise: | 2W @ 30°C |
Thermal Resistance @ Forced Air Flow: | 4°C/W @ 400 LFM | Thermal Resistance @ Natural: | 13°C/W |
Material: | Aluminum |
Part # | Description | Finish | Board Mounting |
533001B02551G | Extruded heat sink with radial fins and solderable pins and device clip | Black Anodize | N/A |
This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component. |
Thermal Resistance | 13.00 |
Technical/Catalog Information | 533001B02551G |
Vendor | Aavid Thermalloy |
Category | Thermal Management |
Attachment Method | Clip and PC Pin |
Height | 1" (25.4mm) |
Material | Aluminum |
Package Cooled | TO-218, TO-247 |
Power Dissipation @ Temperature Rise | 2W @ 30°C |
Thermal Resistance @ Forced Air Flow | 4°C/W @ 400 LFM |
Outline | 34.92mm x 12.70mm |
Thermal Resistance @ Natural | 13°C/W |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | 533001B02551G 533001B02551G |