530401B00100G

BOARD LEVEL HEAT SINK

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SeekIC No. : 003444230 Detail

530401B00100G: BOARD LEVEL HEAT SINK

floor Price/Ceiling Price

US $ 1.16~1.16 / Piece | Get Latest Price
Part Number:
530401B00100G
Mfg:
Supply Ability:
5000

Price Break

  • Qty
  • 0~3500
  • Unit Price
  • $1.16
  • Processing time
  • 15 Days
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Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Quick Details

Capacitance : 16.5 pF Series: -
Manufacturer: Aavid Thermalloy Type: Board Level, Vertical
Package Cooled: TO-218, TO-247 Attachment Method: Bolt On and Board Mounts
Shape: Square Length: 1.750" (44.45mm)
Width: 0.750" (19.05mm) Diameter: -
Height Off Base (Height of Fin): 1.750" (44.45mm) Power Dissipation @ Temperature Rise: 12W @ 70°C
Thermal Resistance @ Forced Air Flow: 2°C/W @ 400 LFM Thermal Resistance @ Natural: 6.3°C/W
Material: Aluminum    

Description

Shape: Square
Diameter: -
Material: Aluminum
Material Finish: Black Anodized
Series: -
Type: Board Level, Vertical
Thermal Resistance @ Forced Air Flow: 2°C/W @ 400 LFM
Manufacturer: Aavid Thermalloy
Width: 0.750" (19.05mm)
Attachment Method: Bolt On and Board Mounts
Package Cooled: TO-218, TO-247
Length: 1.750" (44.45mm)
Height Off Base (Height of Fin): 1.750" (44.45mm)
Thermal Resistance @ Natural: 6.3°C/W
Power Dissipation @ Temperature Rise: 12W @ 70°C


Pinout

  Connection Diagram


Specifications

Part # Description Finish Board Mounting
530401B00100G High rise style heat sink features staggered fins and solderable Wave On mounts Black Anodize View Hole Dimensions
This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component.




Description

Thermal Resistance 6.30

Thermal resistance value of 530401B00100G is based on a 75C rise in natural convection


Parameters:

Technical/Catalog Information530401B00100G
VendorAavid Thermalloy
CategoryThermal Management
Attachment MethodBolt On
Height1.75" (44.45mm)
MaterialAluminum
Package CooledTO-218
Power Dissipation @ Temperature Rise12W @ 70°C
Thermal Resistance @ Forced Air Flow2°C/W @ 400 LFM
Outline44.45mm x 12.45mm
Thermal Resistance @ Natural6.3°C/W
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names 530401B00100G
530401B00100G



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