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520PG0C

Features: · SUITABLE HIGH PULSE CURRENT OPERATION· EXTRA HIGH RADIANT POWER AND RADIANT INTENSITY· HIGH RELIABILITY· LOW FORWARD VOLTAGESpecifications SYMBOL DESCRIPTION BLUE-GREEN UNIT PAD Power Dissipation Per Chip 120 mW VR Reverse Voltage Per Chip 5 V IF Average Forward...

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SeekIC No. : 004232558 Detail

520PG0C: Features: · SUITABLE HIGH PULSE CURRENT OPERATION· EXTRA HIGH RADIANT POWER AND RADIANT INTENSITY· HIGH RELIABILITY· LOW FORWARD VOLTAGESpecifications SYMBOL DESCRIPTION BLUE-GREEN UNIT P...

520PG0C Data Sheet

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Part Number:
520PG0C
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

·  SUITABLE HIGH PULSE CURRENT OPERATION
·  EXTRA HIGH RADIANT POWER AND RADIANT INTENSITY
·  HIGH RELIABILITY
·  LOW FORWARD VOLTAGE


Specifications

SYMBOL DESCRIPTION BLUE-GREEN UNIT
PAD Power Dissipation Per Chip 120 mW
VR Reverse Voltage Per Chip 5 V
IF Average Forward Current Per Chip 30 mA
- Derating Linear From 25°C Per Chip 0.4 mA/°C
Topr Operating Temperature Range -25°C to 85°C
Tstg Storage Temperature Range -40°C to 85°
Lead Soldering Temperature{1.6mm(0.063 inch) From Body}260°C±5°C For 5 Seconds



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