402MS8

Features: SpecificationsDescription The 402MS8E has the following features including +31 dBm Input IP3;High Side LO Ultra Small MSOP8 Package: 14.8mm2;No External Components;Included in the HMC-DK002 Designer's Kit. The 402MS8E are high dynamic range passive MMIC mixers in plastic surface mount 8 ...

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SeekIC No. : 004230253 Detail

402MS8: Features: SpecificationsDescription The 402MS8E has the following features including +31 dBm Input IP3;High Side LO Ultra Small MSOP8 Package: 14.8mm2;No External Components;Included in the HMC-DK00...

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Part Number:
402MS8
Supply Ability:
5000

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  • 1~5000
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  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/6/11

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Product Details

Description



Features:






Specifications






Description

      The 402MS8E has the following features including +31 dBm Input IP3;High Side LO Ultra Small MSOP8 Package: 14.8mm2;No External Components;Included in the HMC-DK002 Designer's Kit.
      The 402MS8E are high dynamic range passive MMIC mixers in plastic surface mount 8 lead Mini Small Outline Packages (MSOP) covering 1.8 to 2.2 GHz. Excellent input IP3 performance of +31 dBm for down conversion and +27 dBm for up conversion is provided for 2.5G & 3G GSM/CDMA based UMTS or PCS applications at an LO drive of +17dBm. With a 1dB compression of +21 dBm, the RF port will accept a wide range of input signal levels.Conversion loss is 8.5dB typical and LO isolations are maintained at 24 to 30 dB. This miniature single-ended monolithic GaAs FET mixer 402MS8E does not require any external components or bias. The broad 50 to 500 MHz IF frequency response will satisfy many UMTS/ PCS transmit or receive frequency plans confi gured for high side LO. The 402MS8E input IP3 performance coupled with its high P1dB rivals traditional active FET mixers while offering a much smaller 14.8mm2 standard IC footprint, and no DC bias.
      The circuit board used in the fi nal application should use RF circuit design techniques. Signal lines should have 50 ohm impedance while the package ground leads and exposed paddle should be connected directly to the ground plane similar to that shown. A suffi cient number of VIA holes should be used to connect the top and bottom ground planes.The evaluation circuit board shown is available from Hittite upon request.
      Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document.






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