Application·Superior cross modulation performance. ·Low reverse transfer capacitance: Crss= 0.015 pF (typ.)·Low noise figure: NF = 1.1dB (typ.) Specifications Characteristics Symbol Rating Unit Drain-source voltage Gate 1-source voltage Gate 2-source voltage Drain current Drai...
3SK226: Application·Superior cross modulation performance. ·Low reverse transfer capacitance: Crss= 0.015 pF (typ.)·Low noise figure: NF = 1.1dB (typ.) Specifications Characteristics Symbol Rat...
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Characteristics |
Symbol |
Rating |
Unit |
Drain-source voltage Gate 1-source voltage Gate 2-source voltage Drain current Drain power dissipation Channel temperature Storage temperature range |
VDS VG1S VG2S ID PD Tch Tstg |
13.5 ±8 ±8 30 150 125 55~125 |
V V V mA mW |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).