Features: • Small Body Outline Dimensions:0.047, x 0.032, (1.20 mm x 0.80 mm)• Low Body Height: 0.020, (0.5 mm)• Stand−off Voltage: 3.3 V − 6.0 V• Low Leakage• Response Time is Typically < 1 ns• ESD Rating of Class 3 (> 16 kV) per Human Body Mo...
3DT5G: Features: • Small Body Outline Dimensions:0.047, x 0.032, (1.20 mm x 0.80 mm)• Low Body Height: 0.020, (0.5 mm)• Stand−off Voltage: 3.3 V − 6.0 V• Low LeakageR...
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Rating |
Symbol |
Value |
Unit |
IEC 61000−4−2 (ESD) Air Contact |
±30 ±30 |
kV | |
IEC 61000−4−4 (EFT) |
40 |
A | |
ESD Voltage Per Human Body Model Per Machine Model |
16 400 |
kV V | |
Total Power Dissipation on FR−5 Board (Note 1) @ TA = 25 Derate above 25 Thermal Resistance Junction−to−Ambient |
PD RJA |
240 1.9 525 |
mW mW/ /W |
Junction and Storage Temperature Range |
TJ, Tstg |
−55 to +150 |
|
Lead Solder Temperature − Maximum (10 Second Duration) |
TL |
260 |
The 3DT5G Series is designed to protect voltage sensitive components from ESD. Excellent clamping capability, low leakage, and fast response time, make these parts ideal for ESD protection on designs where board space is at a premium. Because of its small size, 3DT5G is suited for use in cellular phones, portable devices, digital cameras, power supplies and many other portable applications.