3D7303

Features:

·  All-silicon, low-power CMOS technology
·  TTL/CMOS compatible inputs and outputs
·  Vapor phase, IR and wave solderable
·  Auto-insertable (DIP pkg.)
·  Low ground bounce noise
·  Leading- and trailing-edge accuracy
·  Delay range: 10 through 500ns
·  Delay tolerance: 2% or 1.0ns
·  Temperature stability: ±3% typical (0C-70C)
·  Vdd stability: ±1% typical (4.75V-5.25V)
·  Minimum input pulse width: 20% of total delay
·  14-pin DIP available as drop-in replacement for hybrid delay lines


Pinout

PIN DESCRIPTIONS
I1          Delay Line 1 Input
I2          Delay Line 2 Input
I3          Delay Line 3 Input
O1         Delay Line 1 Output
O2         Delay Line 2 Output
O3         Delay Line 3 Output
VCC       +5 Volts
GND      Ground
N/C       No Connection

Specifications

PARAMETER	SYMBOL	MIN	MAX	UNITS	NOTES
DC Supply Voltage	VDD	-0.3	7.0	V
Input Pin Voltage	VIN	-0.3	VDD+0.3	V
Input Pin Current	IIN	-1.0	1.0	mA	25C
Storage Temperature	TSTRG	-55	150	C	10 sec
Lead Temperature	TLEAD		300	C

Description

The 3D7303 Triple Delay Line product family consists of fixed-delay CMOS integrated circuits. Each package contains three matched,independent delay lines. Delay values can range from 10ns through 500ns. The input is reproduced at the output without inversion,shifted in time as per the user-specified dash number. The 3D7303 is TTL- and CMOS-compatible, capable of driving ten 74LS-type loads, and features both rising- and falling-edge accuracy.

The all-CMOS 3D7303 integrated circuit has been designed as a reliable, economic alternative to hybrid TTL fixed delay lines. It is offered in a standard 8-pin auto-insertable DIP and a space saving surface mount 8-pin SOIC.