BGA HEAT SINK
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Technical/Catalog Information | 374424B00032G |
Vendor | Aavid Thermalloy |
Category | Thermal Management |
Attachment Method | Thermal Tape, Adhesive (Included) |
Height | 0.71" (18.03mm) |
Material | Aluminum |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Power Dissipation @ Temperature Rise | 4W @ 80°C |
Thermal Resistance @ Forced Air Flow | 5°C/W @ 350 LFM |
Outline | 27.00mm x 27.00mm |
Thermal Resistance @ Natural | 20.3°C/W |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | 374424B00032G 374424B00032G |