BGA HEAT SINK
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Technical/Catalog Information | 374324B60023G |
Vendor | Aavid Thermalloy |
Category | Thermal Management |
Attachment Method | Solder Anchor |
Height | 0.39" (9.9mm) |
Material | - |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Power Dissipation @ Temperature Rise | 1.5W @ 50°C |
Thermal Resistance @ Forced Air Flow | 6°C/W @ 500 LFM |
Outline | 27.00mm x 27.00mm |
Thermal Resistance @ Natural | 30.6°C/W |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | 374324B60023G 374324B60023G |