HEATSINK BGA W/O SOLDER ANCHORS
374224B60023G: HEATSINK BGA W/O SOLDER ANCHORS
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Technical/Catalog Information | 374224B60023G |
Vendor | Aavid Thermalloy |
Category | Thermal Management |
Attachment Method | Solder Anchor |
Height | 0.984" (24.99mm) |
Material | Aluminum |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Power Dissipation @ Temperature Rise | 1W @ 20°C |
Thermal Resistance @ Forced Air Flow | 6.4°C/W @ 200 LFM |
Outline | 23.00mm x 23.00mm |
Thermal Resistance @ Natural | 19.7°C/W |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | 374224B60023G 374224B60023G HS329 ND HS329ND HS329 |