BGA HEAT SINK
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Technical/Catalog Information | 373024B00032G |
Vendor | Aavid Thermalloy |
Category | Thermal Management |
Attachment Method | Thermal Tape, Adhesive (Included) |
Height | 0.35" (9mm) |
Material | - |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Power Dissipation @ Temperature Rise | 1.5W @ 50°C |
Thermal Resistance @ Forced Air Flow | 10.0°C/W @ 200 LFM |
Outline | 27.90mm x 27.90mm |
Thermal Resistance @ Natural | 33.3°C/W |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | 373024B00032G 373024B00032G |