HEATSINK BGA W/PUSH PINS
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Technical/Catalog Information | 372924M02000G |
Vendor | Aavid Thermalloy |
Category | Thermal Management |
Attachment Method | Push Pin |
Height | 0.24" (6.10mm) |
Material | Aluminum |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Power Dissipation @ Temperature Rise | 1.5W @ 50°C |
Thermal Resistance @ Forced Air Flow | 10.0°C/W @ 200 LFM |
Outline | 37.40mm x 37.40mm |
Thermal Resistance @ Natural | 32.6°C/W |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | 372924M02000G 372924M02000G HS308 ND HS308ND HS308 |