BGA HEAT SINK
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Technical/Catalog Information | 371824B00035 |
Vendor | Aavid Thermalloy |
Category | Thermal Management |
Attachment Method | Thermal Tape, Adhesive (Included) |
Height | 0.275" (7mm) |
Material | Aluminum |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Power Dissipation @ Temperature Rise | - |
Thermal Resistance @ Forced Air Flow | - |
Outline | 35.00mm x 35.00mm |
Thermal Resistance @ Natural | - |
Lead Free Status | Contains Lead |
RoHS Status | RoHS Non-Compliant |
Other Names | 371824B00035 371824B00035 |