BGA HEAT SINK
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Technical/Catalog Information | 364424B00000G |
Vendor | Aavid Thermalloy |
Category | Thermal Management |
Attachment Method | Thermal Tape, Adhesive (Not Included) |
Height | 0.45" (11.43mm) |
Material | Aluminum |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Power Dissipation @ Temperature Rise | 2W @ 40°C |
Thermal Resistance @ Forced Air Flow | 6.0°C/W @ 200 LFM |
Outline | 40.00mm x 40.00mm |
Thermal Resistance @ Natural | - |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | 364424B00000G 364424B00000G |