33999

Notes
1.Exceeding these limits may cause malfunction or permanent damage to the device.
2.This parameter is guaranteed by design but not production tested.
3.Maximum output clamp energy capability at 150°C junction temperature using single non-repetitive pulse method.
4.ESD data is available upon request. ESD testing is performed in accordance with the Human Body Model (CZAP = 00 pF, RZAP = 1500 ) and the Machine Model (CZAP = 200 pF, RZAP = 0 ).
5.Maximum power dissipation with no heat sink used.
6.Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. xceeding these limits may cause malfunction or permanent damage to the device.
7.Freescale's Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak ackage Reflow Temperature and Moisture Sensitivity Levels (MSL),Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and  eview parametrics.
8.Tested per JEDEC test JESD52-2 (single-layer PWB).
9.Tested per JEDEC test JESD51-8 (two-layer PWB).

The 33999 is a 16-output low-side switch with a 24-bit serial input control. It is designed for a variety of applications including inductive, incandescent, and LED loads. The Serial Peripheral Interface (SPI) provides both input control and diagnostic readout. Eight parallel inputs are also provided for direct Pulse Width Modulation (PWM) control of eight dedicated outputs. Additionally, an output-programmable PWM input provides PWM of any combination of outputs. A dedicated reset input provides the ability to clear all internal registers and turn all outputs off.
The 33999 directly interfaces with microcontrollers and is compatible with both 3.3 V and 5.0 V CMOS logic levels. The 33999, in effect, serves as a bus expander and buffer with fault management features that reduces the MCU's fault management burden.