Features: •Designed to Operate 5.5 V < VPWR < 26.5 V
•16-Bit SPI for Control and Fault Reporting, 3.3 V/5.0 V Compatible
•Outputs Are Current Limited (0.6 A to 1.2 A) to Drive Incandescent Lamps
•Output Voltage Clamp, +45 V (Low Side) and -20 V (High Side) During Inductive Switching
•On/Off Control of Open Load Detect Current (LED Application)
•Internal Reverse Battery Protection on VPWR
•Loss of Ground or Supply Will Not Energize Loads or Damage IC
•Maximum 5.0 A IPWR Standby Current at 13 V VPWR
•RDS(ON) of 0.75 at 25 Typical
•Short Circuit Detect and Current Limit with Automatic Retry
•Independent Overtemperature Protection
•Pb-Free Packaging Designated by Suffix Code EKPinout
Specifications
| Ratings |
Symbol |
Value |
Unit |
| VDD Supply Voltage (1) |
VDD |
-0.3 to 7.0 |
VDC |
| CS, DI, DO, SCLK, IN5, IN6, and EN (1) |
- |
-0.3 to 7.0 |
VDC |
VPWR Supply Voltage (1)
33879
33879A |
VPWR |
-16 to 40
-16 to 45 |
VDC |
| Output Clamp Energy (2) |
ECLAMP |
50 |
mJ |
ESD Voltage (3)
Human Body Model 33879
Machine Model 33879
Human Body Model 33879A
Machine Model 33879A |
VESD1
VESD2
VESD1
VESD2 |
±450
±100
±2000
±200 |
V |
Operating Temperature
Ambient
Junction
Case |
TA
TJ
TC |
-40 to 125
-40 to 150
-40 to 125 |
|
| Storage Temperature |
TSTG |
-55 to 150 |
|
| Power Dissipation (4) |
PD |
1.7 |
W |
Thermal Resistance
Junction to Ambient
Between the Die and the Exposed Die Pad |
RJA
RJC |
71
1.2 |
/W |
| Peak Package Reflow Temperature During Reflow (5), (6) |
TPPRT |
Note 6 |
|
Notes
1.Exceeding these limits may cause malfunction or permanent damage to the device.
2.Maximum output clamp energy capability at 150 junction temperature using single non repetitive pulse method with I = 350 mA.
3.ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ), ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 ).
4.Maximum power dissipation at TA = 25 with no heatsink used.
5.Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device.
6.Freescale's Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
DescriptionThe 33879 device is an 8-output hardware-configurable, high-side/ low-side switch with 16-bit serial input control. Two of the outputs may be controlled directly via microprocessor for PWM applications. The 33879 incorporates SMARTMOS technology, with CMOS logic, bipolar/MOS analog circuitry, and DMOS power MOSFETs. The 33879 controls various inductive, incandescent, or LED loads by directly interfacing with a microcontroller. The circuit's innovative monitoring and protection features include very low standby currents, cascade fault reporting, internal +45 V clamp voltage for low-side configuration, -20 V high-side configuration, output-specific diagnostics, and independent overtemperature protection.
33879 Data Sheet
