BGA HEAT SINK
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Technical/Catalog Information | 335224B00034G |
Vendor | Aavid Thermalloy |
Category | Thermal Management |
Attachment Method | Thermal Tape, Adhesive (Included) |
Height | 0.39" (9.9mm) |
Material | Aluminum |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Power Dissipation @ Temperature Rise | 2W @ 70°C |
Thermal Resistance @ Forced Air Flow | 8°C/W @ 350 LFM |
Outline | 25.00mm x 25.00mm |
Thermal Resistance @ Natural | 34°C/W |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | 335224B00034G 335224B00034G |