300Vin

Features: • DC input range: 180 - 375V• Input surge withstand: 400V for 100ms• DC output: 15V• Programmable output: 10 to 110%• Regulation: ±0.2% no load to full load• Efficiency: 86.5%• Maximum operating temperature:100°C at full load• Power density...

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SeekIC No. : 004227343 Detail

300Vin: Features: • DC input range: 180 - 375V• Input surge withstand: 400V for 100ms• DC output: 15V• Programmable output: 10 to 110%• Regulation: ±0.2% no load to full load&#...

floor Price/Ceiling Price

Part Number:
300Vin
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/21

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Product Details

Description



Features:

• DC input range: 180 - 375V
• Input surge withstand: 400V for 100ms
• DC output: 15V
• Programmable output: 10 to 110%
• Regulation: ±0.2% no load to full load
• Efficiency: 86.5%
• Maximum operating temperature: 100°C at full load
• Power density: 91W/cubic inch
• Height above board: 0.43 in. (10,9 mm)
• Parallelable, with N+M fault tolerance
• Low noise ZCS/ZVS architecture



Application

off-line systems, distributed power and electric vehicles


Specifications

Parameter Rating Unit Notes
+In to -In voltag -0.5 to +375 Vdc
+In to -In voltag 400 Vdc <100ms
PC to -In voltag -0.5 to +7.0 Vdc
PR to -In voltag -0.5 to +7.0 Vdc
+Out to -Out voltag -0.5 to +31.7 Vdc
+Sense to -Out voltag -0.5 to +31.7 Vdc
(R)CSense to -Out volta 1.0 Vdc
SC to -Out voltag -0.5 to +1.5 Vdc
Isolation voltage (in to out) 3000 Vrms
Isolation voltage (in to base) 1550 Vrms
Isolation voltage (out to base) 500 Vrms
Storage temperature (C-Grade -40 to +125 See part numbering chart on this
page for other product grades.
Operating temperature(C-Gade) -20 to +100 Baseplate
Pin soldering temperature 500 (260) () <5sec;wave solder
Pin soldering temperature 750 (390) () <7sec;hand solder
Mounting torque 5 (0.57) in-lbs (N-m) 6 each, # 4-40 or M3



Description

This DC-DC converter module 300Vin uses 2nd Generation power processing, control and packaging technologies to provide th performance, flexibility and cost effectivene expected of a mature power component. For example, a plated-cavity core transform couples widely separated primary and secondary windings, resulting in low in-to out parasitic capacitance and noise.

High frequency ZCS/ZVS switching, advanced power semiconductor packaging and thermal management provide high power density with low temperature gradients. Extensive use of silicon integration results in 1/3 the part count  of a 1st Generation converter.


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