30026-13

Packaging:
   - 352-Terminal Ball Grid Array (BGA) or
   - 320-Pin Staggered Pin Grid Array (SPGA)

0.25-micron four layer metal CMOS process

Split rail design:
   - Available 2.2V, 2.5V, or 2.9V core
   - 3.3V I/O interface (5V tolerant)

Low typical power consumption:
   - 1.0W @ 2.2V/166 MHz
   - 2.5W @ 2.9V/266 MHz

The National Semiconductor^®Geode^TM GXLV 30026-13 is a new line of integrated processors specifically designed to power information appliances for entertain-ment, education, and business. Serving the needs of con-sumers and business professionals alike, it is the perfect solution for information appliance applications such as thin clients, interactive set top boxes, and personal inter-net access devices.

The GXLV processor 30026-13 is divided into three main cat-egories as defined by the core operating voltage. Avail-able with core voltages of 2.2V, 2.5V, and 2.9V, it offers extremely low typical power consumption (1.0W to 2.5W)leading to longer battery life and enabling small form-fac-tor, fanless designs. Each core voltage is offered in fre-quencies that are enabled by specific system clock and multiplier settings. This allows the user to select the device(s) that best fit their power and performance requirements. This flexibility makes the GXLV processor
30026-13 ideally suited for applications where power con-sumptionandperformance(speed)areequallyimportant.
Typical power consumption is defined as an average, measured running Microsoft's Windows at 80% Active Idle (Suspend-on-Halt) with a display resolution of 800x600x8 bpp at 75 Hz.