Features: Application` Low drain−source ON-resistance : RDS (ON) = 90 m (typ.)` High forward transfer admittance : |Yfs| = 10 S (typ.)` Low leakage current : IDSS = 100 A (max) (VDS = 250 V)` Enhancement mode : Vth = 3.0 to 5.0 V (VDS = 10 V, ID = 1 mA...
2SK3994: Features: Application` Low drain−source ON-resistance : RDS (ON) = 90 m (typ.)` High forward transfer admittance : |Yfs| = 10 S (typ.)` Low leakage current : IDSS...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
Characteristic | Symbol | Rating | Unit | |
Drainsource voltage | VDSS | 250 | V | |
Draingate voltage (RGS = 20 k) | VDGR | 250 | V | |
Gatesource voltage | VGSS | ±30 | V | |
Drain current | DC (Note 1) | ID | 20 | A |
Pulse (Note 1) | IDP | 80 | A | |
Drain power dissipation (Tc = 25) | PD | 45 | W | |
Single-pulse avalanche energy (Note 2) |
EAS | 487 | mJ | |
Avalanche current | IAR | 20 | A | |
Repetitive avalanche energy (Note 3) | EAR | 4.5 | mJ | |
Channel temperature | Tch | 150 | ||
Storage temperature range | Tstg | −55~150 |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).