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2SK3904

Features: Application• Low drain-source ON resistance: RDS (ON) = 0.2 (typ.)• High forward transfer admittance: | Yfs| = 9.5 S (typ.)• Low leakage current: IDSS = 100 A (max) (VDS = 450 V)• Enhancement model: Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA)Specifications Characte...

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SeekIC No. : 004226937 Detail

2SK3904: Features: Application• Low drain-source ON resistance: RDS (ON) = 0.2 (typ.)• High forward transfer admittance: | Yfs| = 9.5 S (typ.)• Low leakage current: IDSS = 100 A (max) (VDS...

2SK3904 Data Sheet

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Part Number:
2SK3904
Supply Ability:
5000

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  • 1~5000
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  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:






Application

• Low drain-source ON resistance: RDS (ON) = 0.2 (typ.)
• High forward transfer admittance: | Yfs|  = 9.5 S (typ.)
• Low leakage current: IDSS = 100 A (max) (VDS = 450 V)
• Enhancement model: Vth = 2.0~4.0 V (VDS = 10 V, ID = 1 mA)


Specifications

Characteristic Symbol Rating Unit
Drainsource voltage VDSS 450 V
Draingate voltage (RGS = 20 k) VDGR 450 V
Gatesource voltage VGSS ±30 V
Drain current DC (Note 1) ID 19 A
Pulse (Note 1) IDP 76 A
Drain power dissipation (Tc = 25) PD 150 W
Single-pulse avalanche energy
(Note 2)		 EAS 820 mJ
Avalanche current IAR 19 A
Repetitive avalanche energy (Note 3) EAR 15 mJ
Channel temperature Tch 150
Storage temperature range Tstg −55~150

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).






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