Features: Application• High breakdown voltage: VGDS = −100 V (min)• High input impedance: IGSS = −1.0 nA (max) (VGS = −80 V)Specifications Characteristics Symbol Rating Unit Gate-drain voltage VGDS −100 V Gate current IG 10 mA Drain power dissipation PD 400...
2SK373: Features: Application• High breakdown voltage: VGDS = −100 V (min)• High input impedance: IGSS = −1.0 nA (max) (VGS = −80 V)Specifications Characteristics Symbol Rati...
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Characteristics | Symbol | Rating | Unit |
Gate-drain voltage | VGDS | −100 | V |
Gate current | IG | 10 | mA |
Drain power dissipation | PD | 400 | mW |
Junction temperature | Tj | 125 | |
Storage temperature range | Tstg | −55~125 |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).