ApplicationLow drain-source ON resistance: RDS (ON) = 0.4 (typ.)High forward transfer admittance: |Yfs| = 8.0 S (typ.)Low leakage current: IDSS = 100 A (max) (VDS = 400 V)Enhancement-model: Vth = 2.0 to 4.0 V (VDS = 10 V, ID = 1 mA)Specifications Characteristics Symbol Rating Unit Drai...
2SK3499: ApplicationLow drain-source ON resistance: RDS (ON) = 0.4 (typ.)High forward transfer admittance: |Yfs| = 8.0 S (typ.)Low leakage current: IDSS = 100 A (max) (VDS = 400 V)Enhancement-model: Vth = 2...
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Low drain-source ON resistance: RDS (ON) = 0.4 (typ.)
High forward transfer admittance: |Yfs| = 8.0 S (typ.)
Low leakage current: IDSS = 100 A (max) (VDS = 400 V)
Enhancement-model: Vth = 2.0 to 4.0 V (VDS = 10 V, ID = 1 mA)
Characteristics | Symbol | Rating | Unit | |
---|---|---|---|---|
Drain-source voltage | VDSS | 400 | V | |
Drain-gate voltage (RGS = 20 k) | VDGR | 400 | V | |
Gate-source voltage | VGSS | ±30 | V | |
Drain current | DC (Note 1) | ID | 10 | A |
Pulse (Note 1) | IDP | 40 | ||
Drain power dissipation (Tc = 25) | PD | 80 | W | |
Single pulse avalanche energy (Note 2) |
EAS | 360 | mJ | |
Avalanche current | IAR | 10 | A | |
Repetitive avalanche energy (Note 3) | EAR | 8 | mJ | |
Channel temperature | Tch | 150 | ||
Storage temperature range | Tstg | -55 to150 |