Features: ` Low On-Resistance R DS(on)1 = 12.5 m (MAX.) (VGS = 10 V, ID = 15 A) R DS(on)2 = 16.5 m (MAX.) (VGS = 4.5 V, ID = 15 A) R DS(on)3 = 19.0 m (MAX.) (VGS = 4.0 V, ID = 15 A)` Low Ciss : Ciss = 2290 pF (TYP.)` Built-in Gate protection diodeSpecificationsDrain to Source Voltage (VGS = 0) VDS...
2SK2982: Features: ` Low On-Resistance R DS(on)1 = 12.5 m (MAX.) (VGS = 10 V, ID = 15 A) R DS(on)2 = 16.5 m (MAX.) (VGS = 4.5 V, ID = 15 A) R DS(on)3 = 19.0 m (MAX.) (VGS = 4.0 V, ID = 15 A)` Low Ciss : Ciss...
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Features: High Speed SwitchingLow On-ResistanceNo Secondary BreakdownLow Driving PowerHigh Voltage...
Features: - High Speed Switching- Low On-Resistance- No Secondary Breakdown- Low Driving Power- Hi...
Drain to Source Voltage (VGS = 0) VDSS ......................30 V
Gate to Source Voltage (VDS = 0) VGSS .....................±20 V
Drain Current (DC) I D(DC) ............................±30 A
Drain Current (Pulse) Note I D(pulse) ......................±120 A
Total Power Dissipation (TA = 25°C) PT .....................1.0 W
Total Power Dissipation (TCH = 25°C) PT .................... 30 W
Channel Temperature Tch ...........................150 °C
Storage Temperature Tstg ...................... 55 to + 150 °C
Note:PW 10 s, Duty Cycle 1 %
Remark: The diode connected between the gate and source of the transistor serves as a protector against ESD. When this device actually used, an additional
protection circuit is externally required if a voltage exceeding the rated voltage may be applied to this device.