Features: ` Low on-resistance R DS(on)1 = 27 m (MAX.) (VGS = 10 V, ID = 10 A) R DS(on)2 = 40 m (MAX.) (VGS = 4.5 V, ID = 10 A) R DS(on)3 = 50 m (MAX.) (VGS = 4 V, ID = 10 A)` Low Ciss : Ciss = 860 pF (TYP.)` Built-in gate protection diodeSpecificationsDrain to Source Voltage (VGS = 0) VDSS ..........
2SK2981: Features: ` Low on-resistance R DS(on)1 = 27 m (MAX.) (VGS = 10 V, ID = 10 A) R DS(on)2 = 40 m (MAX.) (VGS = 4.5 V, ID = 10 A) R DS(on)3 = 50 m (MAX.) (VGS = 4 V, ID = 10 A)` Low Ciss : Ciss = 860 p...
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Features: High Speed SwitchingLow On-ResistanceNo Secondary BreakdownLow Driving PowerHigh Voltage...
Features: - High Speed Switching- Low On-Resistance- No Secondary Breakdown- Low Driving Power- Hi...
Drain to Source Voltage (VGS = 0) VDSS ......................30 V
Gate to Source Voltage (VDS = 0) VGSS ..................... ±20 V
Drain Current (DC) I D(DC)............................±20 A
Drain Current (Pulse) Note I D(pulse) ...................... ±80 A
Total Power Dissipation (Tc = 25 °C) PT..................... 20 W
Channel Temperature Tch ...........................150 °C
Storage Temperature Tstg ......................55 to + 150 °C
Note:PW 10 s, Duty Cycle 1 %
Remark :The diode connected between the gate and source of the transistor serves as a protector against ESD. When this device actually used, an additional protection circuit is externally required if a voltage exceeding the rated voltage may be applied to this device.