Application• High breakdown voltage: VGDS = −50 V• High input impedance: IGSS = −1.0 nA (max) (VGS = −30 V)• Low noise: NF = 0.5dB (typ.) (RG = 100 k, f = 120 Hz)• Small package.Specifications Characteristics Symbol Rating Unit Gate-drain voltag...
2SK208: Application• High breakdown voltage: VGDS = −50 V• High input impedance: IGSS = −1.0 nA (max) (VGS = −30 V)• Low noise: NF = 0.5dB (typ.) (RG = 100 k, f = 120 Hz)...
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Features: High Speed SwitchingLow On-ResistanceNo Secondary BreakdownLow Driving PowerHigh Voltage...
Features: - High Speed Switching- Low On-Resistance- No Secondary Breakdown- Low Driving Power- Hi...
Characteristics | Symbol | Rating | Unit |
Gate-drain voltage | VGDS | −50 | V |
Gate current | IG | 10 | mA |
Drain power dissipation | PD | 100 | mW |
Junction temperature | Tj | 125 | |
Storage temperature | Tstg | −55~125 |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).