Application`Low drain-source ON-resistance: RDS(ON)= 1.6 (typ.)`High forward transfer admittance: |Yfs| = 2.0 S (typ.) `Low leakage current: IDSS= 100A (max) (VDS = 200 V)`Enhancement model: Vth = 1.5 ~ 3.5 V (VDS = 10 V, ID= 1 mA)Specifications Characteristic Symbol Rating Unit ...
2SJ680: Application`Low drain-source ON-resistance: RDS(ON)= 1.6 (typ.)`High forward transfer admittance: |Yfs| = 2.0 S (typ.) `Low leakage current: IDSS= 100A (max) (VDS = 200 V)`Enhancement model: Vth = 1...
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Characteristic |
Symbol |
Rating |
Unit | |
Drain-source voltage Drain-gate voltage (RGS=20k) Gate-source voltage |
VDSS VDGR VGSS |
-200 -200 ±20 |
V V V | |
Drain current | DC (Note 1) |
ID |
-2.5 |
A |
Pulse (Note 1) |
IDP |
-10 | ||
Drain power dissipation (Tc=25) Single pulse avalanche energy (Note 2) Avalanche current Repetitive avalanche energy (Note 3) Channel temperature Storage temperature range |
PD EAS IAR EAR Tch Tstg |
20 97.5 -2.5 2.0 150 -55~150 |
W mJ A mJ |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept an Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).