Features: •Low drain−source ON resistance : RDS (ON) = 0.16 (typ.) •High forward transfer admittance : |Yfs| = 3.5 S (typ.) •Low leakage current : IDSS = −100 A (VDS = −50 V) •Enhancement−mode : Vth = −...
2SJ537: Features: •Low drain−source ON resistance : RDS (ON) = 0.16 (typ.) •High forward transfer admittance : |Yfs| = 3.5 S (typ.) •Low leakage curre...
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Item |
Symbol |
Ratings |
Unit | |
Drain-Source Voltage |
VDSS |
-50 |
V | |
Drain−gate voltage (RGS = 20 k) |
VDGR |
−50 |
V | |
Gate-Source Voltage |
VGSS |
±20 |
V | |
Drain Current | DC (Note 1) |
ID IDP |
-5 -15 |
A |
Pulse (Note 1) | ||||
Drain power dissipation |
PD |
0.9 |
W | |
Channel Temperature |
Tch |
150 |
||
Storage Temperature |
Tstg |
-55~150 |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).