2SD2216L

Features: • High foward current transfer ratio hFE• Mold leadless type package, allowing downsizing and thinning of the equipment and automatic insertion through the tape packingSpecifications Parameter Symbol Ratings Unit Collector-base voltage V...

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SeekIC No. : 004224580 Detail

2SD2216L: Features: • High foward current transfer ratio hFE• Mold leadless type package, allowing downsizing and thinning of the equipment and automatic insertion through the tape packingSpecific...

floor Price/Ceiling Price

Part Number:
2SD2216L
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2024/5/16

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Product Details

Description



Features:

• High foward current transfer ratio hFE
• Mold leadless type package, allowing downsizing and thinning of the equipment and automatic insertion through the tape packing



Specifications

Parameter
Symbol
Ratings
Unit

Collector-base voltage

VCBO
60
V
Collector-emitter voltage
VCEO
50
V
Emitter-base voltage
VEBO
7
V
Peak collector current
ICP
200
mA
Collector current
Ic
100
mA
Collector power dissipation
PC
150
mW
Junction temperature
Tj
125
°C
Storage temperature
Tstg
-55~ +125
°C
Printed circuit board: Copper foil area of 1cm2 or more, and the board thickness of 1.7mm for the collector portion


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