28F1602C3

` Flash Memory Plus SRAM
-Reduces Memory Board Space Required, Simplifying PCB Design Complexity
` Stacked Chip Scale Package Technology
-Smallest Memory Subsystem Footprint
-16-Mbit Flash + 2-Mbit SRAM:
Area: 8 mm by 10 mm, Height: 1.4 mm
-32-Mbit Flash + 4-Mbit SRAM,
16-Mbit Flash + 4-Mbit SRAM:
Area: 8 mm by 12 mm, Height: 1.4 mm
` Advanced SRAM Technology
-70 ns Access Time
-Low Power Operation
-Low Voltage Data Retention Mode
` Flash Data Integrator (FDI) Software
-Real-Time Data Storage and Code
Execution in the Same Memory Device
-Full Flash File Manager Capability
` Advanced+ Boot Block Flash Memory
-90 ns 16-Mb Access Time at 2.7 V
-100 ns 32-Mb Access Time at 2.7 V
-Instant, Individual Block Locking
-128-bit Protection Register
-12 V Production Programming
-Ultra Fast Program and Erase Suspend
-Extended Temperature 40 °C to +85 °C
` Blocking Architecture
-Block Sizes for Code + Data Storage
-4-Kword Parameter Blocks (for data)
-64-Kbyte Main Blocks (for code)
-1,000,000 Erase Cycles per Block
` Low Power Operation
-Async Read Current: 9 mA
-Standby Current: 10 mA
-Automatic Power Saving Mode
` 0.25 mm ETOX™ VI Flash Technology
` Industry Compatibility
-Sourcing Flexibility and Stability