27LV64

Features:

• Wide voltage range 3.0V to 5.5V
• High speed performance
   - 200 ns access time available at 3.0V
• CMOS Technology for low power consumption
   - 8 mA active current at 3.0V
   - 20 mA active current at 5.5V
   - 100mA standby current
• Factory programming available
• Auto-insertion-compatible plastic packages
• Auto ID aids automated programming
• Separate chip enable and output enable controls
• High speed "express" programming algorithm
• Organized 8K x 8: JEDEC standard pinouts
   - 28-pin Dual-in-line package
   - 32-pin PLCC Package
   - 28-pin SOIC package
   - Tape and reel
• Available for the following temperature ranges:
   - Commercial: 0°C to +70°C
   - Industrial: -40°C to +85°C


Pinout




Specifications

VCC and input voltages w.r.t. VSS....... -0.6V to + 7.25V
VPP voltage w.r.t. VSS during
programming .......................................... -0.6V to +14V
Voltage on A9 w.r.t. VSS ...................... -0.6V to +13.5V
Output voltage w.r.t. VSS ............... -0.6V to VCC +1.0V
Storage temperature .......................... -65°C to +150°C
Ambient temp. with power applied ..... -65°C to +125°C


Description

The Microchip Technology Inc. 27LV64 is a low-voltage (3.0 volt) CMOS EPROM designed for battery powered applications. The device is organized as 8K x 8 (8KByte) non-volatile memory product. The 27LV64 consumes only 8mA maximum of active current during a 3.0 volt read operation therefore improving battery performance. This device is designed for very low voltage applications where conventional 5.0 volt only EPROMs can not be used. Accessing individual bytes from an address transition or from power-up (chip enable pin going low) is accomplished in less than 200 ns at 3.0V. 27LV64 allows system designers the ability to use low voltage non-volatile memory with today's low voltage microprocessors and peripherals in battery powered applications.

A complete family of 27LV64 packages is offered to provide the most flexibility in applications. For surface mount applications, PLCC or SOIC packaging is available. Tape and reel packaging is also available for PLCC or SOIC packages.