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256-K

Features: `Mobile Intel® Celeron® Processor with the following Processor core/bus speeds:-1.333 GHz/133 MHz at 1.50 V-1.200 GHz/133 MHz at 1.45 V-1.133 GHz/133 MHz at 1.45 V-1.066 GHz/133 MHz at 1.45 V-1.000 GHz/133 MHz at 1.40 V`Low Voltage Mobile Intel Celeron Processor (0.13 ) with the ...

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SeekIC No. : 004217369 Detail

256-K: Features: `Mobile Intel® Celeron® Processor with the following Processor core/bus speeds:-1.333 GHz/133 MHz at 1.50 V-1.200 GHz/133 MHz at 1.45 V-1.133 GHz/133 MHz at 1.45 V-1.066 GHz/133 MH...

256-K Data Sheet

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Part Number:
256-K
Supply Ability:
5000

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  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/24

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Product Details

Description



Features:

`Mobile Intel® Celeron® Processor with the following Processor core/bus speeds:
-1.333 GHz/133 MHz at 1.50 V
-1.200 GHz/133 MHz at 1.45 V
-1.133 GHz/133 MHz at 1.45 V
-1.066 GHz/133 MHz at 1.45 V
-1.000 GHz/133 MHz at 1.40 V
`Low Voltage Mobile Intel Celeron Processor (0.13 ) with the following Processor core/bus speeds:
-733/133 MHz at 1.15 V
-650/100 MHz at 1.15 V
`Ultra Low Voltage Mobile Intel Celeron processor (0.13 ) with the following Processor core/bus speeds:
-733/133 MHz at 1.10V
-700/100 MHz at 1.10V
-667/133 MHz at 1.10 V
-650/100 MHz at 1.10 V
`Supports the Intel Architecture with Dynamic Execution
`On-die primary 16-Kbyte instruction cache and 16-Kbyte write-back data cache
`On-die second level cache (256-Kbyte) with Advanced Transfer Cache Architecture
`Data Prefetch Logic
`Integrated AGTL termination
`Integrated math co-processor
`Micro-FCPGA and Micro-FCBGA packaging technologies
-Supports thin form factor notebook designs
-Exposed die enables more efficient heat dissipation
-Mobile ULV and LV Celeron processor (0.13 ) are available only in Micro-FCBGA package.
-Mobile Intel Celeron processors at 1.45 V and 1.50 V are available only in Micro-FCPGA package.
`Fully compatible with previous Intel microprocessors
-Binary compatible with all applications
-Support for MMX™ technology
-Support for Streaming SIMD Extensions
`Power Management Features
-Quick Start and Deep Sleep modes provide low power dissipation
`On-die thermal diode


Specifications

Symbol
Parameter
Min
Max
Unit
Notes
TStorage
 Storage Temperature
-40
85
°C
1
VCC(Abs)
 Supply Voltage with respect to VSS
-0.5
1.75
V
VCCT
 System Bus Buffer Voltage with respect to VSS
0.3
1.75
V
VINGTL
 System Bus Buffer DC Input Voltage with respect to VSS
0.3
1.75
V
2,3
VIN125
 1.25V Buffer DC Input Voltage with respect to VSS
0.3
1.75
V
4
VIN15
 1.5V Buffer DC Input Voltage with respect to VSS
0.3
2.0
V
5
VIN18
 1.8V Buffer DC Input Voltage with respect to VSS
0.3
2.0
V
6
VIN20
 2.0V Buffer DC Input Voltage with respect to VSS
0.3
2.4
V
7
VIN25
 2.5V Buffer DC Input Voltage with respect to VSS
0.3
3.3
V
9
VINVID
 VID ball/pin DC Input Voltage with respect to VSS
-
3.465
V
8
IVID
 VID Current
0.3
3.6
mA
8
NOTES:
1. The shipping container is only rated for 65°C.
2. Parameter applies to the AGTL signal groups only. Compliance with both VIN GTL specifications is required.
3. The voltage on the AGTL signals must never be below 0.3 V or above 1.75 V with respect to ground.
4. Parameter applies to CLKREF, TESTHI, VTTPWRGD signals.
5. Parameter applies to CMOS, Open-drain, APIC, TESTLO and TAP bus signal groups only.
6. Parameter applies to PWRGOOD signal.
7. Parameter applies to PICCLK signal.
8. Parameter applies to each VID pin/ball individually.
9. Parameter applies to BCLK signal in Single Ended Clocking Mode.


Description

The Mobile Intel Celeron Processor has some configuration options that are determined by hardware and some that are determined by software. The 256-K hardware configuration at reset on the active-to-inactive transition of RESET#. The P6 Family of Processors Developer's Manual describes these configuration options. Some of the configuration options for the Mobile Intel Celeron Processor are described in the remainder of this section.




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