HEATSINK BGA W/CLIP
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Technical/Catalog Information | 2522B-EP04-BGS5 |
Vendor | Aavid Thermalloy |
Category | Thermal Management |
Attachment Method | Clip |
Height | 0.4" (10.16mm) |
Material | - |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Power Dissipation @ Temperature Rise | - |
Thermal Resistance @ Forced Air Flow | 7.0°C/W @ 200 LFM |
Outline | 38.10mm x 38.10mm |
Thermal Resistance @ Natural | 22°C/W |
Lead Free Status | Contains Lead |
RoHS Status | RoHS Non-Compliant |
Other Names | 2522B EP04 BGS5 2522BEP04BGS5 HS310 ND HS310ND HS310 |