Features: `Package in 8mm tape on 7diameter reel.`Compatible with automatic placement equipment.`Compatible with infrared and vapor phase reflow solder process.`Mono-color type.`Pb-free.`The product itself will remain within RoHS complaint versionApplication·Automotive: backlighting in dashboard a...
25-21SYGC/S530-XX/TR8: Features: `Package in 8mm tape on 7diameter reel.`Compatible with automatic placement equipment.`Compatible with infrared and vapor phase reflow solder process.`Mono-color type.`Pb-free.`The product...
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Parameter |
Symbol |
Rating |
Unit |
Reverse Voltage |
VR |
5 |
V |
Forward Current |
IF |
25 |
mA |
Operating Temperature |
Topr |
-40 ~ +85 |
|
Storage Temperature |
Tstg |
-40 ~ +90 |
|
Electrostatic Discharge(HBM) |
ESD |
2000 |
V |
Power Dissipation |
Pd |
60 |
mW |
Peak Forward Current (Duty 1/10 @1KHz) |
IF |
160 |
mA |
Soldering Temperature |
Tsol |
Reflow Soldering : 260 for 10 sec. Hand Soldering : 350 for 3 sec. |
·The 25-21 SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.
·Besides, light weight makes 25-21 be ideal for miniature applications. etc.