24-21SYGC/S530-XX/TR8

Features: `Package in 8mm tape on 7diameter reel.`Compatible with automatic placement equipment.`Compatible with infrared and vapor phase reflow solder process.`Mono-color type.`Pb-free.`The product itself will remain within RoHS compliant version.Application·Automotive: backlighting in dashboard ...

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24-21SYGC/S530-XX/TR8 Picture
SeekIC No. : 004216698 Detail

24-21SYGC/S530-XX/TR8: Features: `Package in 8mm tape on 7diameter reel.`Compatible with automatic placement equipment.`Compatible with infrared and vapor phase reflow solder process.`Mono-color type.`Pb-free.`The product...

floor Price/Ceiling Price

Part Number:
24-21SYGC/S530-XX/TR8
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2024/11/20

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Product Details

Description



Features:

`Package in 8mm tape on 7diameter reel.
`Compatible with automatic placement equipment.
`Compatible with infrared and vapor phase reflow solder process.
`Mono-color type.
`Pb-free.
`The product itself will remain within RoHS compliant version.



Application

·Automotive: backlighting in dashboard and switch.
·Telecommunication: indicator and backlighting in telephone and fax.
·Flat backlight for LCD, switch and symbol.
·General use.



Specifications

Reverse Voltage VR............................... 5 V
Forward Current IF ...........................25 mA
Operating Temperature Topr...-40 ~ +85
Storage Temperature Tstg........-40~ +90
Soldering Temperature Tsol ....260(for 5 second)
Electrostatic Discharge ESD............ 2000 V
Power Dissipation Pd ......................60 mW
Peak Forward Current (Duty 1/10 @1KHz) IF ....60 mA



Description

·The 24-21 SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.

·Besides, lightweight makes 24-21SYGC/S530-XX/TR8 ideal for miniature applications. etc.




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