Features: • Low leakage, low zener impedance and maximum power dissipation of 500 mW.• Wide spectrum from 1.9V through 38V of zener voltage provide flexible application.• LLD Package is suitable for high density surface mounting and high speed assembly.Specifications Ite...
23544: Features: • Low leakage, low zener impedance and maximum power dissipation of 500 mW.• Wide spectrum from 1.9V through 38V of zener voltage provide flexible application.• LLD Packa...
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• Low leakage, low zener impedance and maximum power dissipation of 500 mW.
• Wide spectrum from 1.9V through 38V of zener voltage provide flexible application.
• LLD Package is suitable for high density surface mounting and high speed assembly.
Item |
Symbol |
Value |
Unit |
Reverse voltage |
pd * |
500 |
mW |
Junction temperature |
Tj |
175 |
|
Storage temperature |
Tstg |
-55 to +15 |
* With P.C. Board.