Features: • Ideal for pick-and-place circuit assembly• Low mounting height• Suitable for reflow soldering• Small ceramic diameter for faster response• Low heat transfer to substrate• Flat terminations for stable positioning and good solderability.ApplicationR...
232266197: Features: • Ideal for pick-and-place circuit assembly• Low mounting height• Suitable for reflow soldering• Small ceramic diameter for faster response• Low heat transfer...
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Features: Surface mount multilayer surge suppressorInherent bidirectional clampingLow capacitance ...
The 232266197 consists of a high-performance PTC ceramic disc mounted in a lead-frame for direct soldering onto a printed-circuit board (PCB) or substrate.
232266197 is soldered to the leadframe by a local reflow process, during which the solder layer is melted to the metallized ceramic surface using a low residue flux.