BOARD LEVEL HEAT SINK
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Capacitance : | 16.5 pF | Series: | - |
Manufacturer: | Aavid Thermalloy | Type: | Board Level |
Package Cooled: | BGA | Attachment Method: | Thermal Tape, Adhesive (Not Included) |
Shape: | Square | Length: | 0.655" (16.64mm) |
Width: | 0.655" (16.64mm) | Diameter: | - |
Height Off Base (Height of Fin): | 0.265" (6.73mm) | Power Dissipation @ Temperature Rise: | 1W @ 40°C |
Thermal Resistance @ Forced Air Flow: | 17.5°C/W @ 300 LFM | Thermal Resistance @ Natural: | - |
Material: | Aluminum |
Technical/Catalog Information | 2283B |
Vendor | Aavid Thermalloy |
Category | Thermal Management |
Attachment Method | Thermal Tape, Adhesive (Not Included) |
Height | 0.265" (6.73mm) |
Material | Aluminum |
Package Cooled | - |
Power Dissipation @ Temperature Rise | 1W @ 40°C |
Thermal Resistance @ Forced Air Flow | 17.5°C/W @ 300 LFM |
Outline | 16.64mm x 16.64mm |
Thermal Resistance @ Natural | - |
Lead Free Status | Contains Lead |
RoHS Status | RoHS Non-Compliant |
Other Names | 2283B 2283B |